Miniaturization of electronic and mechanical devices has permitted complex and sophisticated products to be realized inexpensively in compact packages. Such miniaturization has developed based primarily on advances in silicon wafer processing for circuit fabrication or micro-electromechanical systems. Unfortunately, at this point in time the incremental improvement of silicon wafer processing cannot lead to further significant enhancements in miniaturization. New nano-scale technologies that greatly reduce the size of circuits, actuators, and multiplexers will bring about the next wave of smaller, sophisticated devices.